HPP FOIL COPPER TAPE
HPP Copper Foil Tape
Copper HPC661 tape is developed for specialty shielding applications; typically IC chips, electrical cabinets, cables, motors and static dissipation. HPC665 tape is designed for conductivity through the entire construction.
The copper foil surface of HPC661 is electrically conductive, conformable and easy to apply. Its release liner aids in die cutting. The EMI/RFI shielding seals components from radiating or leaking interference. The copper foil and adhesive of HPC665 are both electrically conductive and the release liner aids in die cutting. Both tapes offer solvent resistance.
HPP Brand Copper Foil Tape
| Part # | Color | Adhesive System |
Backing Thickness |
Adhesive Thickness |
Total Thickness |
Adhesion Strength | Tensile Strength | Elong. | Temperature Range | ||||||||
| mil | mm | mil | mm | mil | mm | oz/in | g/cm | lbs/in | kg/cm | % | Min °F | Max °F | Min °C | Max °C | |||
| FOIL-COPPER | |||||||||||||||||
| HPC661 | Copper | A | 1.5 | 0.038 | 2.0 | 0.051 | 3.5 | 0.089 | 80 | 882 | 70 | 12.7 | <16 | -40 | 250 | -40 | 121 |
| HPC665 | Copper | A | 1.5 | 0.038 | 2.0 | 0.051 | 3.5 | 0.089 | 35 | 386 | 90 | 16.0 | -- | -40 | 250 | -40 | 121 |